Technical information

3D IMAGING
Power Suppy115 V/230 V ± 10% – 50/60Hz – 7.5 A @ 230V / 10 A @ 115V
Sensor typeCMOS
Sensor Area13 x 13 cm
Imaging modalitiesDentition, TMJ R, TMJ L
Field of view8,5cm x 8,5cm (height x diameter)
Detector pixel size 100 µm ( 200µm in binning 2×2)
Voxel size160 µm
Acquisition rate2 frames per degree
Tube head rotation230°
Dynamic range14 bit gray level (max 16.384)
Number of acquired frames460
Scan time/Exp.time15 s / 9,2 s
Exposure time14,3/15,0 s (Child/Adult, Standard PAN)
PAN IMAGING PROGRAMSAdult panoramic Child panoramic Option 3 layer focal PAN TMJ closed/open mouth Sinus Sectorial panoramic • Emi Panoramic R • Emi Panoramic L • Low dose Pan • Ortho panoramic • Incisors • Bitewing R – Bitewing L – Bitewing r + L Patient selection : Adult/child, 3 size for all modalities
CEPHALOMETRIC IMAGING
Sensor Type FLAT PANEL phosphor plate with direct on- board image acquisition and transmission (no need to remove the phosphor plate)
Image Format24cm x 30cm
Exposure typeSingle shot
Acquisition time2 s
Setting and exposure time2 mAs – 30 mAs ( 0,2-3 s)
CEPH PROGRAMS L/L
P/A
A/P
X RAY GENERATOR
Generator type High frequency DC
Focal spot0,5 mm
Total filtration> 2,5 mm Aleq @ 70 kV)
Leakage radiationAccording to IEC 60601-2-63:
Leakage radiation at 1 m< 0.5 mGy/h @ 86 kVp – 10 mA – 3 s duty cycle 1/16
Anodic voltage61 to 85 kV, step 3 kV
Anodic current4 to 10 mA 9 steps
GENERAL
Weight125 Kg
Dimensions (HxWxD) 2230mm x 1720mm x 1070mm